Effect of a tie layer on the delamination toughness of polypropylene and polyamide-66 microlayers

Abstract

The effect of a thin tie layer on the adhesion of polypropylene (PP) and polyamide-66 (PA) was studied by delamination of microlayers. The microlayers consisted of many alternating layers of PP and PA separated by a thin layer of a maleated PP. The peel toughness and delamination failure mode were determined using the T-peel test. Without a tie layer, there was no adhesion between PP and PA. A tie layer with 0.2% MA provided some adhesion; however, delamination occurred by interfacial failure. Increasing the maleic anhydride (MA) content of the tie layer increased the interfacial toughness. With 0.5% MA, the interfacial toughness exceeded the craze condition of PP, and a transition from interfacial delamination to craze delamination occurred. Crazing ahead of the crack tip effectively reduced the stress concentration at the interface and dramatically increased the delamination toughness. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 1461–1467, 1999