Homologous temperature dependence of global surface scaling behaviors of polycrystalline copper films

Abstract

A strategy integrating structure zone model with dynamic scaling theory was proposed to study the global surface dynamics of polycrystalline Cu films deposited at different homologous temperature Ts/Tm. The evolution of roughness exponent α and growth exponent β reveals a transition from random deposition to surface diffusion dominated smoothening in the lower Ts/Tm regime and then to rapid surface roughening in the higher Ts/Tm regime. In contrast to that of amorphous films, the distinct scaling behavior in higher Ts/Tm regime arises from the change of anisotropic mass transport mechanisms, which could be related to the texture evolution during growth.