Millimeter-Wave Printed Circuit Board Characterization Using Substrate Integrated Waveguide Resonators

Abstract

This paper proposes a substrate integrated waveguide (SIW) cavity-based method that is compliant with ground-signal-ground (GSG) probing technology for dielectric characterization of printed circuit board materials at millimeter wavelengths. This paper presents the theory necessary to retrieve dielectric parameters from the resonant characteristics of SIW cavities with particular attention placed on the coupling scheme and means for obtaining the unloaded resonant frequency. Different sets of samples are designed and measured to address the influence of the manufacturing process on the method. Material parameters are extracted at <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i> - and <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">W</i> -band from measured data with the effect of surface roughness of the circuit metallization taken into account.