Demonstration of 30-Tbps/cm2 Bandwidth Density by Silicon Optical Interposers Fully Integrated with Optical Components

Abstract

Silicon optical interposers for inter-chip interconnects, integrated with lasers, optical splitters, modulators, waveguides and photodetectors on a single silicon substrate were demonstrated. They were optically complete and closed systems. We achieved 20-Gbps error-free data transmission and a 30-Tbps/cm2 bandwidth density using these interposers.