Low stress PECVD—SiN<i><sub>x</sub></i>layers at high deposition rates using high power and high frequency for MEMS applications - Concepedia

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Low stress PECVD—SiN<i><sub>x</sub></i>layers at high deposition rates using high power and high frequency for MEMS applications

40

Citations

18

References

2006

Year

Ciprian Iliescu, Francis E. H. Tay, Jiashen Wei

Journal of Micromechanics and Microengineering

Abstract

10.1088/0960-1317/16/4/025

References

	Year	Citations

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