Process and equipment simulation of copper chemical vapor deposition using Cu(hfac)vtms - Concepedia

Concepedia

Publication | Closed Access

Process and equipment simulation of copper chemical vapor deposition using Cu(hfac)vtms

11

Citations

11

References

1999

Year

H. Wolf, Jürgen Röber, Stephan Riedel, Reinhard Streiter

Microelectronic Engineering

Materials ScienceElectrical EngineeringEngineeringNanomanufacturingEquipment SimulationChemical DepositionMicroelectronicsChemical Vapor Deposition

References

	Year	Citations

Page 1