High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins

Abstract

Bulk Cu foils have been synthesized via magnetron sputtering with an average twin spacing of 5nm. Twin interfaces are of {111} type and normal to the growth direction. Growth twins with such high twin density and preferred orientation have never been observed in elemental metals. These Cu foils exhibited tensile strengths of 1.2GPa, a factor of 3 higher than that reported earlier for nanocrystalline Cu, average uniform elongation of 1%–2%, and ductile dimple fracture surfaces. This work provides a route for the synthesis of ultrahigh-strength, ductile pure metals via control of twin spacing and twin orientation in vapor-deposited materials.