Publication | Closed Access
Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications
32
Citations
31
References
2014
Year
Materials ScienceElectronic Packaging ApplicationsSinteringEngineeringMechanical PropertiesNanomaterialsNanotechnologyMetal NanoparticlesMechanical EngineeringSilver NanoparticlesMetallic NanomaterialsElectronic Packaging
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