Thermal behavior of residual strain in silicon-on-insulator bonded wafer and effects on electron mobility - Concepedia

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Thermal behavior of residual strain in silicon-on-insulator bonded wafer and effects on electron mobility

11

Citations

9

References

1999

Year

Tsutomu Iida, Takamasa Itoh, Yukio Takáno, Adarsh Sandhu, Kazuyuki Shikama

Solid-State Electronics

Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringSemiconductor DeviceApplied PhysicsThermal BehaviorResidual StrainSemiconductor Device FabricationElectron MobilityElectronic PackagingSilicon On InsulatorElectrical Insulation

References

	Year	Citations

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