Publication | Closed Access
Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders
44
Citations
27
References
2015
Year
Materials ScienceMaterials EngineeringThermomechanical PropertiesIntermetallic Layer FormationEngineeringMechanical EngineeringElectronic PackagingAlloy PhaseThermomechanical ProcessingMicrostructureMetal Processing
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