Characterization of thermally activated dislocation mechanisms using transient tests - Concepedia

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Characterization of thermally activated dislocation mechanisms using transient tests

58

Citations

13

References

2002

Year

Jean‐Luc Martin, B. Lo Piccolo, T. Kruml, J. Bonneville

Materials Science and Engineering A

Transient TestsDamage MechanismEngineeringDislocation InteractionMechanical EngineeringThermomechanical AnalysisThermal EngineeringMechanics Of Materials

References

	Year	Citations

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