Publication | Closed Access
Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds
72
Citations
32
References
2013
Year
Materials EngineeringMaterials ScienceEngineeringCorrosionMetallurgical InteractionMetallurgical ProcessWeld Pool SolidificationChemistrySolidificationCu6sn5 PrecipitationMetal ProcessingMicrostructureInterfacial Intermetallic Compounds
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