Additive-effects during plating in acid tin methanesulfonate electrolytes

Modern Electroplating

Frederick A. Lowenheim, J. H. Davis · Journal of The Electrochemical Society · 1974 · 147 citations

Social Sciences, Communication, Electrochemistry +6

Environment-Friendly Electronics: Lead-Free Technology

Journal of Electronic Packaging · 2005 · 98 citations · Full text

Engineering, Electrical Engineering, Materials Science +9

The Electrochemistry of Tin

Stuart G. Meibuhr, Ernest Yeager, Akiya Kozawa et al. · Journal of The Electrochemical Society · 1963 · 54 citations · Full text

Natural Sciences, Chemistry, Materials Science +17

Spectroelectrochemical Study of the Effect of Organic Additives on the Electrodeposition of Tin

Igor S. Zavarine, O. Khaselev, Yun Zhang · Journal of The Electrochemical Society · 2003 · 32 citations

Natural Sciences, Chemistry, Materials Science +17

The High Speed Electrodeposition of Sn/Pb Alloys

Paul A. Kohl · Journal of The Electrochemical Society · 1982 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +17