Microstructural evolution of intermetallic compounds in Sn–3.5Ag–X (X = 0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging - Concepedia

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Microstructural evolution of intermetallic compounds in Sn–3.5Ag–X (X = 0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging

22

Citations

21

References

2009

Year

Jie Chen, Jun Shen, Shiqiang Lai, Dong Joon Min, Xiaochuan Wang

Journal of Alloys and Compounds

Materials ScienceIntermetallic CompoundsEngineering/Cu Solder JointsMechanical EngineeringMetallurgical InteractionMicrostructural EvolutionAlloy PhaseMetallurgical SystemMicrostructure

References

	Year	Citations

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