Journal of The Electrochemical Society · 1993 · 43 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceElectrochemistrySurface ScienceThin FilmsElectrode MaterialsElectrode-electrolyte InterfacesIndustrial ElectrochemistryAlloy DepositionElectrochemical DepositionElectrochemical Surface EngineeringElectrode FabricationElectrodepositionElectrolytic DepositionMultilayer Stacks
A dual‐bath electrodeposition method using two separate plating solutions has been developed for the production of thin‐film metal multilayers. The technique has been used to make and multilayers with repeat lengths of 19 Å and above. The microstructure of both homogeneous and multilayered deposits indicates that in these systems surface reaction of the film as it is transferred between the electrolytes does not disrupt multilayer formation. The properties of films formed using dual‐bath electrodeposition are described and application of the method to other alloy systems is discussed.