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<title>Thermoelectric properties of bismuth telluride thin films deposited by radio frequency magnetron sputtering</title>

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2005

Year

Abstract

This paper reports the thermoelectric properties of intrinsic N-type bismuth telluride (Bi<sub>2</sub>Te<sub>3</sub>) thin films (2.5-10 &#956;m thickness). These films were deposited using radio frequency (R.F.) magnetron sputtering. These properties include; Seebeck coefficient and electrical resistivity at different temperatures. It has been observed that the Seebeck coefficient and electrical resistivity of thin films are approximately -150 &#956;V/°C and 4 x 10<sup>-5</sup> ohm-m at room temperature, respectively. The maximum value of Seebeck coefficient of approximately -287 &#956;V/°C was observed at 54 °C for a film thickness of 9.8 &#956;m. The microstructural characteristics of the thin films were investigated using Scanning Electron Microscopy and X-Ray Diffraction analysis. It was observed that the thicker the Bi<sub>2</sub>Te<sub>3</sub> film, the larger the grain size. The observed grain sizes were approximately 900 nm and 1500 nm for Bi<sub>2</sub>Te<sub>3</sub> film of 2.6 &#956;m and 9.8 &#956;m thicknesses, respectively. The XRD analysis indicated the presence of rhombohedral (Bi<sub>2</sub>Te<sub>3</sub>) crystal structures.

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