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<title>Thermoelectric properties of bismuth telluride thin films deposited by radio frequency magnetron sputtering</title>
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2005
Year
Thin Film PhysicsMagnetic PropertiesEngineeringRadio FrequencyThermoelectricsThin Film Process TechnologyMagnetismThin Film ProcessingThermoelectric PropertiesMaterials SciencePhysicsOxide ElectronicsSemiconductor MaterialFilm ThicknessNatural SciencesApplied PhysicsCondensed Matter PhysicsThermoelectric MaterialThin Films
This paper reports the thermoelectric properties of intrinsic N-type bismuth telluride (Bi<sub>2</sub>Te<sub>3</sub>) thin films (2.5-10 μm thickness). These films were deposited using radio frequency (R.F.) magnetron sputtering. These properties include; Seebeck coefficient and electrical resistivity at different temperatures. It has been observed that the Seebeck coefficient and electrical resistivity of thin films are approximately -150 μV/°C and 4 x 10<sup>-5</sup> ohm-m at room temperature, respectively. The maximum value of Seebeck coefficient of approximately -287 μV/°C was observed at 54 °C for a film thickness of 9.8 μm. The microstructural characteristics of the thin films were investigated using Scanning Electron Microscopy and X-Ray Diffraction analysis. It was observed that the thicker the Bi<sub>2</sub>Te<sub>3</sub> film, the larger the grain size. The observed grain sizes were approximately 900 nm and 1500 nm for Bi<sub>2</sub>Te<sub>3</sub> film of 2.6 μm and 9.8 μm thicknesses, respectively. The XRD analysis indicated the presence of rhombohedral (Bi<sub>2</sub>Te<sub>3</sub>) crystal structures.
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