Complexation Chemistry in Copper Plating from Citrate Baths

Abstract

An experimental and theoretical study of the influence of solution chemistry on the electrodeposition of copper from complexing citrate baths is proposed and discussed. The behavior of the system is described in terms of the relative distribution of various copper-citrate complexes, combined with a model mechanism for electrodeposition kinetics involving an adsorbed blocking intermediate. Studies of partial-current polarization curves for copper deposition over a wide range of solution pH and free citrate concentration substantiate the mechanism and offer convincing evidence for the significant role of solution chemistry in the electroreduction process. In addition to the copper system, the mechanism proposed offers a framework that may be useful for the study of other metals and alloys electrodeposited from complexing baths containing citrate or citrate-like molecules.