Mechanical Properties of Plasma‐Polymerized Tetravinylsilane Films

Abstract

Abstract Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma‐polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Young's modulus and hardness as a function of the indenter displacement (5–500 nm) were investigated for films of 1‐µm thickness. The Young's modulus (hardness) was observed to increase from 8.3 (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic–plastic material. magnified image