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Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study

Industrial DesignEngineeringAdvanced Packaging (Semiconductors)Industrial EngineeringChip On BoardComputer EngineeringComparative StudyChip AttachmentThermal ModelingManufacturing EngineeringHeat TransferElectronic PackagingThermal EngineeringThermal Parameters Optimization3D PrintingReflow Soldering ProfileRefrigeration