A high-speed, low-power capacitive-coupling transceiver for wireless wafer-level testing systems

Abstract

A high-speed, low-power capacitive-coupling transceiver is presented for wireless wafer-level testing systems. The proposed transceiver achieves the highest data rate of 15Gb/s in 65nm CMOS process which is 7.5 times higher than previous work. The parallel termination increases the signal bandwidth in a printed circuit board (PCB) by 8.5 times. The glitch signaling reduces the static power consumption of conventional nonreturn-to-zero (NRZ) signaling by 30%. These two design techniques lead to the lowest energy per bit of 0.47pJ/b in a chip-to-board communication.