Effects of Cure Temperature on Epoxy Resin Properties

Abstract

Abstract An experimental study was undertaken to determine the effects of incomplete resin cure on the dynamic moduli and tensile strengths of two commercial amine-cured epoxy adhesives. Depending on the value of Tgα - Tcure, a resin may glass before complete cross-linking occurs leaving the system in a nearly-stable undercured state. The level of unreacted epoxy in the glass state was determined by FTIR, and the effects on dynamic mechanical properties and tensile bond strengths measured.