Vacuum‐Assisted Aerosol Deposition of a Low‐Dielectric‐Constant Periodic Mesoporous Organosilica Film

Abstract

Low-dielectric-constant periodic mesoporous organosilica thin films are fabricated by vacuum-assisted aerosol deposition, a vapor-phase delivery technique favored by the semiconductor industry. The mesostructured films possess a combination of dielectric and mechanical properties that make them an ideal candidate for insulating materials on semiconductor chips (see image). Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.