Optics Express · 2008 · 253 citations · 30 references
EngineeringMaterials EngineeringMaterials ScienceDrillingMetallic MaterialsMetallurgyLaser Material ProcessingMetalsOptical FibersUltrafast OpticsBreakthrough TimeDrilling EfficiencyLaser DrillingShieldingThermal ConductivityThermal Conductivity EffectsThermal Effects In Laser ProcessingUltrafast Laser Material Processing
The study investigates high‑speed laser drilling of metal sheets using an ytterbium‑doped fiber CPA system delivering ultrashort pulses at 50–975 kHz and up to 68 W average power. The authors measured the number of pulses required to perforate steel and copper sheets up to 1 mm thick as a function of repetition rate and pulse energy. They found that particle shielding reduces ablation efficiency while heat accumulation counteracts it; for high‑thermal‑conductivity copper both effects are negligible, enabling 0.5 mm copper holes to be trepanned in as little as 75 ms.
We present an experimental study on the drilling of metal targets with ultrashort laser pulses at high repetition rates (from 50 kHz up to 975 kHz) and high average powers (up to 68 Watts), using an ytterbium-doped fiber CPA system. The number of pulses to drill through steel and copper sheets with thicknesses up to 1 mm have been measured as a function of the repetition rate and the pulse energy. Two distinctive effects, influencing the drilling efficiency at high repetition rates, have been experimentally found and studied: particle shielding and heat accumulation. While the shielding of subsequent pulses due to the ejected particles leads to a reduced ablation efficiency, this effect is counteracted by heat accumulation. The experimental data are in good qualitative agreement with simulations of the heat accumulation effect and previous studies on the particle emission. However, for materials with a high thermal conductivity as copper, both effects are negligible for the investigated processing parameters. Therefore, the full power of the fiber CPA system can be exploited, which allows to trepan high-quality holes in 0.5mm-thick copper samples with breakthrough times as low as 75 ms.
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