Journal of Electronic Materials · 2012 · 40 citations · 13 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials ChemistryMetallic MaterialsNanomaterialsGrain GrowthGrain RefinementGrain Structure AnalysisGrain Structure FormationMetalsNanowiresAnnealingBonding MechanismsGrain Growth MechanismsGrain Growth ModelingGrain Structure EffectsMicrostructural Evolution During AnnealingTwinning-induced StrengtheningWire Bonding
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Ultrahigh Strength and High Electrical Conductivity in Copper
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Revealing the Maximum Strength in Nanotwinned Copper
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Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper
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Substructures in explosively deformed Cu and Cu-Al alloys
O. Johari, G. Thomas · Acta Metallurgica · 1964 · 117 citations · Full text
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