Interfacial reaction between Sn1Ag0.5Cu(Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction - Concepedia

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Interfacial reaction between Sn1Ag0.5Cu(Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction

26

Citations

17

References

2008

Year

K.S. Lin, Her-Yueh Huang, C. P. Chou

Journal of Alloys and Compounds

Materials ScienceMaterials EngineeringInterfacial ReactionCu SubstrateEngineeringCorrosionSurface ScienceMetallurgical InteractionMetallurgical ProcessChemistrySurface ProcessingSurface ReactivityAu/ni Surface FinishMetal Processing

References

	Year	Citations

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