Publication | Open Access
Nano-embossing technology on ferroelectric thin film Pb(Zr0.3,Ti0.7)O3 for multi-bit storage application
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Citations
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References
2011
Year
EngineeringMulti-bit Storage ApplicationStagger StructureThin Film Process TechnologyNano-embossing TechnologyDifferent Layer ThicknessFerroelectric ApplicationNanoelectronicsPiezoelectric MaterialNano-embossing TechniqueThin Film ProcessingMaterials ScienceMaterials EngineeringElectrical EngineeringNanotechnologyOxide ElectronicsPiezoelectricityPyroelectricityFerroelasticsApplied PhysicsThin Films
In this work, we apply nano-embossing technique to form a stagger structure in ferroelectric lead zirconate titanate [Pb(Zr0.3, Ti0.7)O3 (PZT)] films and investigate the ferroelectric and electrical characterizations of the embossed and un-embossed regions, respectively, of the same films by using piezoresponse force microscopy (PFM) and Radiant Technologies Precision Material Analyzer. Attributed to the different layer thickness of the patterned ferroelectric thin film, two distinctive coercive voltages have been obtained, thereby, allowing for a single ferroelectric memory cell to contain more than one bit of data.
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