Publication | Closed Access
Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating
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Citations
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References
2014
Year
Materials ScienceElectrical EngineeringEngineeringSurface ElectrochemistrySurface ScienceChemical Vapor DepositionThin FilmsChemical DepositionCopper DirectCobalt Thin FilmsThin Film ProcessingElectrochemistry
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