Electrodeposition of Ni–SiC Composite from a Non-Aqueous Bath

Abstract

Electrodeposited Ni–SiC composite deposits with SiC were produced on copper substrate using a non-aqueous organic solvent. -Methylformamide was found to be the most suitable solvent as it has a high dielectric constant (182) that allows high tolerance of the electrolyte in the bath, which is ordinarily not obtained in other solvents. The optimum condition arrived for deposition was nickel acetate , boric acid , SiC , current density , duration of electrolysis , and bath temperature . Satisfactory bright composite deposits were obtained, which were quite adherent to the copper base. Scanning electron microscope, energy-dispersive analysis by x ray, and X-ray diffraction studies have been performed to characterize the composites. Effect of current density on composition and microhardness of the composite deposits was investigated. Also, the effect of annealing on the microhardness of the deposits was studied.