Applied Physics Letters · 2007 · 25 citations · 10 references
Natural SciencesMaterials SciencePhysicsInterface SciencePhysical ChemistryThin FilmsChemical Vapor DepositionSilicon MaterialsStrain EngineeringThin Film AnnealingThin-film DepositionPlasma-assisted Chemical Vapor DepositionPlasma-enhanced Chemical Vapor DepositionPlasma-enhanced DepositionRutherford ScatteringSiliconSilicon DioxideStrain EnergyStrain Energy Density
Silicon nanoclusters were formed in plasma-enhanced chemical vapor deposited substoichiometric silicon oxide films by annealing at 1100°C for 1∕2h as a function of different deposition parameters. The samples were analyzed by energy filtered transmission electron microscopy and Rutherford backscattering. At any deposition condition, the clustered silicon concentration is significantly lower than the initial silicon excess concentration. This behavior is explained by taking into account the free energy difference between the metastable SiO and stable SiO2 phase and the strain energy associated with the different atomic densities of Si and SiO2.
10
Coherent fluctuations and nucleation in isotropic solids
John W. Cahn · Acta Metallurgica · 1962 · 293 citations
Computer simulation of spinodal decomposition in constrained films
Dong Jin Seol, Shenyang Hu, Yulan Li et al. · Acta Materialia · 2003 · 130 citations
Natural Sciences, Materials Engineering, Materials Science +10
F. Rochet, G. Dufour, H. Roulet et al. · Physical review. B, Condensed matter · 1988 · 124 citations
Natural Sciences, Materials Engineering, Materials Science +17