Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1993 · 10 citations · 0 references
EngineeringMaterials EngineeringMaterials ScienceHeat TransferSemiconductor DevicesThermal AnalysisChemical Vapor DepositionDevice ModelingLaser DiodesSemiconductor Device MaterialsSemiconductor LasersThermal Properties Of SemiconductorsChemical Vapor Deposition MaterialsDiamond Semiconductor DevicesDiamond SemiconductorsSilicon WafersThermal ConductivityThermal Effects In Laser ProcessingThermal Management In Semiconductor LasersThermal Management Of Semiconductor Devices
Diamond made by a dc arc-jet chemical vapor deposition (CVD) process is being successfully applied as a packaging material for semiconductor lasers. This CVD process is capable of making free-standing wafers up to 15 cm in diameter with thermal conductivity values similar to natural, type IIa diamond. A novel mathematical analysis using the surface element method was performed to predict the most cost effective size for a CVD diamond submount as a function of the laser size. A literature review of thermal modelling studies and performance testing indicates the outstanding performance benefits which can be realized with CVD diamond laser diode submounts.