Publication | Closed Access
Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations
16
Citations
14
References
1999
Year
Chemical EngineeringEngineeringModerate-to-high Copper IonCorrosionSurface ElectrochemistryElectroless Copper DepositionChemistryChemical DepositionChemical KineticsElectrode Reaction MechanismElectrochemistryLow-to-moderate Formaldehyde Concentrations
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