Publication | Closed Access
Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad
77
Citations
9
References
2004
Year
Materials ScienceInterfacial ReactionsEngineeringElectrode-electrolyte InterfaceSurface ElectrochemistrySurface ScienceSn–zn SoldersChemistryElectronic PackagingElectrochemistryElectrochemical Surface Science
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