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Study in IC chip failure during pick-up process by using experimental and finite element methods

Electrical EngineeringReliability EngineeringEngineeringChip-scale PackageHardware ReliabilityPhysic Of FailureChip On BoardFinite Element MethodsComputer EngineeringChip AttachmentElectronic PackagingMicroelectronicsIc Chip FailurePick-up Process