Toward High Thermal Conductivity Nano Micro Epoxy Composites with Sufficient Endurance Voltage

Abstract

AbstractWe are aiming at the development of epoxy composite materials with both high thermal conductivity and sufficient voltage endurance. A target is set as 10 W/m/K with 5 kV withstand voltage for power electronics applications. In order to achieve high thermal conductivity for polymers such as epoxy, it is a common method to fill inorganic micro particles with high thermal conductivity, but such composites prepared in this way shows lower endurance voltage. To compensate such negative performance, it is considered to be a good way to add nano sized inorganic particles. After many trials were made, good results were obtained for a composite material with two modes of BN and alumina and surface treated nano silica. It has thermal conductivity larger than 5- 10 W/m/K with reasonable withstand voltage.Keywords: NanocompositeNano-microcompositeHigh thermal conductivityEndurance voltageSilicaAluminaBoron nitride Additional informationNotes on contributorsToshikastu TanakaToshikastu Tanaka (IEEE SM'95-F'00). He is Fellow at Waseda University IPS Research Center. He worked as Professor at Waseda University for 7 years until FY2008. Doctor of Engineering (Osaka University). Worked for CRIEPI for 38 years, and temporarily for Salford University in UK (1970–72), Rennselaer Polytechnic Institute and General Electric in the USA (1975–76), and Kyushu University in Japan (1993–1998). Recipient of Ministry of Science and Technology Prize in 2000., IEEJ Technology Progress Award in 1988, IEEE Whitehead Memorial Lecture Award in 2000 and IEEE Dakin Award in 2002. He is active in IEEJ (Fellow), IEEE (Fellow), and CIGRE (Senior).Masahiro KozakoMasahiro Kozako is an Assistant Professor at Department of Electrical Engineering and Electronics, Kyusyu Institute of Technology. He was born on 13 August, 1974 in Tokyo. He received the B. Eng., M. Eng., and Dr. Eng. Degrees in electrical engineering from Kyushu Institute of Technology in 1997, 1999, and 2002, respectively. He worked at Waseda University for 3 years and at Kagoshima National College of Technology for 3 years. His research interests concern the development of new insulating polymer nano-composite materials and the development of diagnostic technique of electric power apparatus. He is a member of the IEEJ and the IEEE.Kenji OkamotoKenji Okamoto received the Ph.D. degree in electrical engineering from Tokai University, Kanagawa, Japan, in 2002. In 1982, he joined Fuji Electric Corporate Research and Development, Ltd., Tokyo, Japan, and since then he has been involved in solid insulation technology of epoxy mould, etc. and its application to products. Primarily, he has conducted research on electrical deterioration with regard to partial discharge and voltage-time characteristics of epoxy resin. For some years, he has been engaged in studying the application of metal-base printed circuit board to a power circuit for general purpose inverters, power modules and so on. In 2011, he joined Fuji Electric Co., Ltd. as the Manager in the Fundamental Technology Research Center. He is a member of the IEEJ, JIEP and the IMAPS.