The directed-assembly of CdS interconnects between targeted points in a circuit

Abstract

We demonstrate the one-step dielectrophoretic assembly and interfacing of individual interconnects from populations of 3.7 nm CdS nanoparticles between targeted points in a circuit. We further show that the nanoparticles fuse into bulk CdS during the fabrication process. This finding is significant because it establishes a critical step towards the fabrication of structurally continuous semiconducting interconnects from nanoscopic building blocks.