Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese Alloy Electrodeposits

Abstract

The spontaneous growth of tin whiskers on electrodeposited tin-manganese alloy coatings has been observed. This growth is distinct from any previously reported whisker growth on either pure tin or other tin-based alloy electrodeposits. It has an extremely short incubation period of a few hours only, followed by a spectacularly rapid and profuse growth. During the whole period of whisker growth, the tin-manganese electrodeposits were found to be in a tensile residual stress state. This rules out the commonly accepted explanation of a compressive stress as the driving force for tin whisker growth.