Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology - Concepedia

Concepedia

Publication | Closed Access

Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology

29

Citations

16

References

2007

Year

Hyu-Sang Kwon, Kwang-Cheol Lee

Sensors and Actuators A Physical

Acoustic CameraRigid BackplateDouble-chip Condenser Microphone

References

	Year	Citations

Page 1