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Subsurface hydrogenated amorphous silicon to μ<i>c</i>-hydrogenated silicon transformation during magnetron sputter deposition determined by spectroscopic ellipsometry
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Citations
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References
1994
Year
Reactive Magnetron SputteringEngineeringPhysicsH InterfaceSurface ScienceApplied PhysicsAmorphous SiliconSemiconductor Device FabricationSilicon TransformationHydrogenThin Film Process TechnologySilicon On InsulatorAmorphous SolidSitu Spectroscopic EllipsometryThin Film ProcessingMagnetron Sputter Deposition
We use in situ spectroscopic ellipsometry to analyze the microstructure of the μc-Si:H/a-Si:H interface deposited by reactive magnetron sputtering of a Si target in (Ar+H2). We increase the hydrogen pressure to promote μc-Si:H formation and observe several effects. Initially, H penetrates ∼45 Å into the a-Si:H substrate and increases its hydrogen content. Then ∼55 Å of hydrogen-rich a-Si:H deposits. Finally, μc-Si:H nucleates on top of this ∼100 Å thick, high H-content a-Si:H interface layer. As μc-Si:H grows, the thickness of the amorphous interface layer decreases by ∼40 Å; the void fraction in the μc-Si:H layer is always ≤15 vol %, ruling out the possibility that the a-Si:H is etched away. These results suggest that a-Si:H can be transformed into μc-Si:H in a subsurface region under appropriate conditions.
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