Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation - Concepedia

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Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

280

Citations

29

References

2003

Year

Alex A. Volinsky, Joseph B. Vella, W. W. Gerberich

Thin Solid Films

Materials ScienceMaterial AnalysisEngineeringMechanical PropertiesFracture ToughnessMechanical EngineeringApplied PhysicsTime-dependent Dielectric BreakdownThin FilmsElectrical PropertyThin Film ProcessingElectrical Insulation

References

	Year	Citations

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