New aromatic silicon‐containing polyamides

Abstract

Abstract As part of an ongoing program to prepare and evaluate thermally‐stable, processable materials, 18 aromatic, silicon containing polyamides (structures shown below) have been synthesized via interfacial polymerization of six silicon‐containing diacid chlorides with 3,3′‐diaminodiphenyl‐nethane, 3,3′‐diaminobenzophenone, and l‐(3′‐amino‐benzy)‐4‐(3″aminobenzoyl)benzene. All polyamides were soluble in m‐cresol and N,N‐dimethylacetamide and had glass transition temperatures between 178 and 254°C, Thermogravimetric analyses conducted in static air on film specimens were‐ 1 used to show 5 and 10 percent weight losses between 331–400°C and 354–440°C, respectively. magnified image 3,3′‐ and 4,4′‐silane isomers R = R′ = Me; R = Me; R′ = Ph; R = R′ = Ph