Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure - Concepedia

Concepedia

Publication | Closed Access

Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

26

Citations

19

References

2005

Year

Q. L. Zeng, Wang Zhongguang, Ai‐Ping Xian, Jin Shang

Journal of Electronic Materials

Materials ScienceMaterials EngineeringEngineeringCorrosionCyclic SofteningMechanical EngineeringMetallurgical InteractionEquiaxed Grain StructureAlloy PhaseMetallurgical SystemMicrostructure

References

	Year	Citations

Page 1