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An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling

Electrical EngineeringEngineeringExperimental InvestigationHeat Transfer EnhancementThermal ManagementComputer EngineeringHigh-flux Chip CoolingIntegrated CircuitsHeat TransferElectronic PackagingHeat Pipe–heat SinkThermal EngineeringHeat Pipe