Measurement of thermal-mechanical noise in microelectromechanical systems

Abstract

We report absolute measurements of thermal-mechanical noise in microelectromechanical systems. The devices are studied with an optical microcavity technique that has a resolution on the order of tens of femtometers per root hertz. The measured noise spectrum agrees with the calculated noise level to within 25%, a discrepancy most likely due to uncertainty in the effective dynamic mass of the vibrating bridge. These measurements demonstrate that thermal-mechanical noise can be the dominant noise source in actuated microelectromechanical devices.