Publication | Closed Access
Prediction of microelectronic substrate warpage using homogenized finite element models
22
Citations
3
References
2006
Year
Wafer Scale ProcessingEngineeringMechanical EngineeringMaterial ModelingMultiscale MaterialSemiconductor Device FabricationElectronic PackagingMicroelectronicsMicroelectronic Substrate WarpageMechanics Of MaterialsMicrostructureMultiscale Modeling
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