Concepedia

Prediction of microelectronic substrate warpage using homogenized finite element models

Parsaoran Hutapea, Joachim L. Grenestedt, Mitul Modi, M. Mello, Kristopher Frutschy

Microelectronic Engineering · 2006 · 23 citations · 3 references

DOI

Concepts

References

3

Effect of temperature on elastic properties of woven-glass epoxy composites for printed circuit board applications

Parsaoran Hutapea, Joachim L. Grenestedt · Journal of Electronic Materials · 2003 · 49 citations

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Influence of electric artwork on thermomechanical properties and warpage of printed circuit boards

Joachim L. Grenestedt, Parsaoran Hutapea · Journal of Applied Physics · 2003 · 19 citations

, , +17

Using waviness to reduce thermal warpage in printed circuit boards

Joachim L. Grenestedt, Parsaoran Hutapea · Applied Physics Letters · 2002 · 17 citations

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