The plastic deformation of silicon between 300°C and 600°C

Abstract

Abstract Constant strain-rate compression of silicon single crystals has been performed under a hydrostatic pressure of 1500 MPa. The crystals were deformed at temperatures as low as 300°C and had resolved flow stress values of up to 1000 MPa. The variation of yield strength with temperature suggests a transition of the mechanism controlling the deformation near 600°C.