Selective Electroless Copper Deposition within Block Copolymer Microdomains

Abstract

We demonstrate a method for the directed formation of layered metallic copper structure within the subsurface morphology of a bulk lamellar block copolymer. Using an electroless deposition process, copper was selectively deposited inside the interconnected microdomain network of the water-permeable block containing preloaded palladium ions. The relatively simple process yields a novel nanoscale composite consisting of alternating layers of metallic copper with those of the hydrocarbon block matrix. The extent of the copper deposition can be controlled by adjusting the deposition rate and deposition time.