Acoustic attenuation measurements in transparent materials in the hypersonic range by picosecond ultrasonics

Abstract

The authors report on acoustic attenuation measurements in transparent thin films by picosecond ultrasonics. This ultrafast technique has already been proposed for such measurements but usually attenuation is overestimated and a specific sample configuration is needed. Here they present another way of using this technique which overcomes both difficulties. Experimental results obtained for silica show a very good agreement with literature. This validates the protocol which is then applied to various other materials used in microelectronics.