Simulation and experiments on friction and wear of diamond: a material for MEMS and NEMS application

Abstract

To date most of the microelectromechanical system (MEMS) devices have been based on silicon. This is due to the technological know-how accumulated on the manipulation, machining and manufacturing of silicon. However, only very few devices involve moving parts. This is because of the rapid wear arising from high friction in these silicon-based systems. Recent tribometric experiments carried out by Gardos on silicon and polycrystalline diamond (PCD) show that this rapid wear is caused by a variety of factors, related both to surface chemistry and cohesive energy density of these likely MEMS bearing materials. In particular, the 1.8-times stronger C-C bond in diamond as opposed to the Si-Si bond in the bulk translates into a more than 10 4 -times difference in wear rates, even though the difference in flexural strength is only 20-times, in hardness 10-times and in fracture toughness 5-times. It also has been shown that the wear rates of silicon and PCD are controlled by high-friction-induced surface cracking, and the friction is controlled by the number of dangling, reconstructed or adsorbate-passivated surface bonds. Therefore, theoretical and tribological characterization of Si and PCD surfaces is essential prior to device fabrication to assure reliable MEMS operation under various atmospheric environments, especially at elevated temperatures.