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Current transport studies of ZnO∕p-Si heterostructures grown by plasma immersion ion implantation and deposition
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Citations
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References
2006
Year
EngineeringSpace ChargeOptoelectronic DevicesSilicon On InsulatorSemiconductor DeviceSemiconductorsIon ImplantationElectronic DevicesNanoelectronicsCurrent Transport StudiesNitrogen-doped Zno∕p-si HeterojunctionsSemiconductor TechnologyElectrical EngineeringPhysicsOxide ElectronicsZno∕p-si HeterostructuresOxide SemiconductorsSemiconductor MaterialSemiconductor Device FabricationMicroelectronicsSurface ScienceApplied PhysicsMultilayer HeterostructuresAnderson Model
Rectifying undoped and nitrogen-doped ZnO∕p-Si heterojunctions were fabricated by plasma immersion ion implantation and deposition. The undoped and nitrogen-doped ZnO films were n type (n∼1019cm−3) and highly resistive (resistivity ∼105Ωcm), respectively. While forward biasing the undoped-ZnO∕p-Si, the current follows Ohmic behavior if the applied bias Vforward is larger than ∼0.4V. However, for the nitrogen-doped-ZnO∕p-Si sample, the current is Ohmic for Vforward<1.0V and then transits to J∼V2 for Vforward>2.5V. The transport properties of the undoped-ZnO∕p-Si and the N-doped-ZnO∕p-Si diodes were explained in terms of the Anderson model and the space charge limited current model, respectively.
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