AN INNOVATIVE CONCEPT AND ITS EFFECTS ON WHEEL SURFACE TOPOGRAPHY IN DRY GRINDING BY RESIN AND VITRIFIED BOND CBN WHEEL

Abstract

In the dry grinding process, as there is no coolant lubricant to transfer the heat from the contact zone, minimizing the grinding specific energy and grinding forces is a matter of importance. Some of the results of the systematic research works, based on a novel concept to make a step forward for pure dry grinding, are presented. The new concept is based on the fact that the optimisation of the chip formation reduces the friction and rubbing in the process. Such optimisation was achieved by a special conditioning process. The result showed a drastic reduction in grinding forces and no burning or damages on the surface of workpiece using the novel method comparing to conventional wheel with the same material removal rate. A theoretical discussion is also presented to support the experimental results.